Description: Improve the manufacturing processes associated with large format (1280x720 & 640x480), small pixel (20 um), dual band (MWIR & LWIR) 3rd Gen Focal Plane Arrays (FPAs). These FPAs are key to enabling this objective capability for the high performance ground and air sensor systems of FCS .
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Rockwell Scientific Company |
$958 |
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For-Profit |
Camarillo,
CA
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Citation
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Source:
Appropriations Report Language - Conference
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Reference:
108-622
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Location:
Line 181, Page 271
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Citation Excerpt: Third Generation Dual Band Infrared Imagers
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