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Agency:    Department of Defense--Military
Bureau:    Research, Development, Test, and Evaluation
Account:    Research, development, test, and evaluation, Air Force (57-3600)
Certifying Official:    Deputy Comptroller Program/Budget
Contact Information:    http://WWW.DOD.GOV   703-697-5131
Three-Dimensional Packaging Technology for High Speed RF Communication

1 recipient will receive $1,966,000. This is a continuing earmark.
Year Enacted: 2005
Description: Design, fabricate, and demonstrate proof-of-principle, experimental 3-D microcircuit packaging. The resulting multi-chip modules would meet the military need for high-speed electrical and high-power thermal characteristics as well as the environmental and reliability requirements.
Beneficiary/Recipient Amount ($K) Program Type Address
International Technology Center (lead) North Carolina State U of Arkansas U of Florida $1,966 Public Educational Institution
Research Triangle Park, NC
Source: Appropriations Report Language - Conference
Reference: 108-622
Location: Line 8, Page 322
Citation Excerpt: Three-Dimensional Packaging Technology for High Speed RF Communication

Last Modified: 16-Apr-2007

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