Earmark - Three-Dimensional Packaging Technology for High Speed RF Communication

Agency:		Department of Defense--Military
Bureau:		Research, Development, Test, and Evaluation
Account:		Research, development, test, and evaluation, Air Force (57-3600)
Certifying Official:		Deputy Comptroller Program/Budget
Contact Information:		http://WWW.DOD.GOV 703-697-5131

Three-Dimensional Packaging Technology for High Speed RF Communication

1 recipient will receive $1,966,000. This is a continuing earmark.

Year Enacted: 2005

Description: Design, fabricate, and demonstrate proof-of-principle, experimental 3-D microcircuit packaging. The resulting multi-chip modules would meet the military need for high-speed electrical and high-power thermal characteristics as well as the environmental and reliability requirements.

Beneficiary/Recipient	Amount ($K)	Program	Type	Address
International Technology Center (lead) North Carolina State U of Arkansas U of Florida	$1,966		Public Educational Institution	Research Triangle Park, NC

Citation

Source: Appropriations Report Language - Conference

Reference: 108-622

Location: Line 8, Page 322

Citation Excerpt: Three-Dimensional Packaging Technology for High Speed RF Communication

Last Modified: 16-Apr-2007