Earmark - Advanced Technologies for Printed Wing Assembly fabrication (PWB-HVPC)

Agency:		Department of Defense--Military
Bureau:		Research, Development, Test, and Evaluation
Account:		Research, development, test, and evaluation, Navy (17-1319)
Certifying Official:		Deputy Comptroller Program/Budget
Contact Information:		http://WWW.DOD.GOV 703-697-5131

Advanced Technologies for Printed Wing Assembly fabrication (PWB-HVPC)

1 recipient will receive $3,278,000. This is a continuing earmark.

Year Enacted: 2005

Description: This effort developed technologies and techniques to reverse engineer and repair multilayer printed circuit boards in Navy systems. Technologies included applying discrete sequence spread spectrum technologies for high resolution imaging of multilayer boards and laser assisted through hole and line metallization on boards.

Beneficiary/Recipient	Amount ($K)	Program	Type	Address
THE PENNSYLVANIA STATE UNIVERSITY APPLIED RESEARCH LABORATORY	$3,278		Public Educational Institution	UNIVERSITY PARK, PA

Citation

Source: Appropriations Report Language - Conference

Reference: 108-622

Location: Line 16, Page 289

Citation Excerpt: Advanced Technologies for Printed Wing Assembly fabrication (PWB-HVPC)

Last Modified: 16-Apr-2007